The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Sep. 26, 2017
Applicant:

Sumitomo Electric Industries, Ltd., Osaka-shi, JP;

Inventors:

Takashi Kyono, Itami, JP;

Hideyuki Ijiri, Itami, JP;

Takao Nakamura, Itami, JP;

Hiromi Nakanishi, Itami, JP;

Takatoshi Ikegami, Itami, JP;

Kuniaki Ishihara, Itami, JP;

Yohei Enya, Itami, JP;

Tetsuya Kumano, Itami, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/00 (2006.01); H01S 5/022 (2006.01); G02B 6/42 (2006.01); H01S 5/40 (2006.01); H01S 5/024 (2006.01); G02B 6/00 (2006.01);
U.S. Cl.
CPC ...
H01S 5/022 (2013.01); G02B 6/00 (2013.01); G02B 6/4239 (2013.01); G02B 6/4251 (2013.01); G02B 6/4265 (2013.01); H01S 5/0222 (2013.01); H01S 5/0226 (2013.01); H01S 5/02252 (2013.01); H01S 5/02292 (2013.01); H01S 5/02415 (2013.01); H01S 5/4012 (2013.01); H01S 5/4093 (2013.01); H01S 5/005 (2013.01); H01S 5/0071 (2013.01); H01S 5/02216 (2013.01); H01S 5/02438 (2013.01); H01S 5/02476 (2013.01);
Abstract

An optical moduleaccording to an embodiment includes a plurality of laser diodes (LDs)to, a multiplexing optical systemcombining a plurality of laser beams from the respective plurality of LDs, and a packageaccommodating the plurality of LDs and the multiplexing optical system. The package includes a support mounted with the multiplexing optical system, and a cap having a transmissive window that allows a resultant light beam to pass through. At least one of the LDs has an oscillation wavelength of nor more than 550 nm. The package has an internal moisture content of not more than 3000 ppm. The multiplexing optical system is fixed to the support by a resin curing adhesive.


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