The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2019
Filed:
Mar. 19, 2015
Applicant:
Nec Corporation, Minato-ku, Tokyo, JP;
Inventor:
Taras Kushta, Tokyo, JP;
Assignee:
NEC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01Q 1/48 (2006.01); H01Q 1/52 (2006.01); H01Q 9/04 (2006.01); H01Q 21/06 (2006.01); H01Q 21/00 (2006.01); H01Q 15/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/523 (2013.01); H01Q 1/38 (2013.01); H01Q 1/48 (2013.01); H01Q 9/045 (2013.01); H01Q 9/0421 (2013.01); H01Q 21/0025 (2013.01); H01Q 21/0087 (2013.01); H01Q 21/065 (2013.01); H01Q 15/0086 (2013.01);
Abstract
It is an object of the present invention to provide compact and wideband array antennas based on multilayer substrate technologies which can be applied in lightweight radars. An antenna radiating element disposed in a multilayer substrate comprises a signal via; a plurality of ground vias surrounding the signal via; a radiation pad connected to one end of the signal via; a feed pad connected to another end of the signal vias; and an artificial medium disposed between the signal via and the ground vias; wherein the multilayer substrate comprises a plurality of conductor layers isolated by a dielectric material.