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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10333067 B1

PDFFull Text
Date of Patent:
Jun. 25, 2019

Filed:

Jun. 21, 2016

Method for manufacturing organic electronic element, and method for forming electron hole injection layer

Applicant:

Sumitomo Chemical Company, Limited, Tokyo, JP;

Inventors:

Shuichi Sassa, Osaka, JP;

Shinichi Morishima, Niihama, JP;

Kouichi Rokuhara, Tsukuba, JP;

Assignee:

SUMITOMO CHEMICAL COMPANY, LIMITED, Chuo-ku, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

William Coleman

Int. Cl.
CPC ...
H01L 51/00 (2006.01); H01L 29/786 (2006.01); H05B 33/02 (2006.01); H05B 33/10 (2006.01); H01L 51/50 (2006.01); H01L 51/05 (2006.01); H01L 51/42 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0026 (2013.01); H01L 29/786 (2013.01); H01L 51/0097 (2013.01); H01L 51/5088 (2013.01); H05B 33/02 (2013.01); H05B 33/10 (2013.01); H01L 51/0003 (2013.01); H01L 51/0039 (2013.01); H01L 51/0043 (2013.01); H01L 51/0512 (2013.01); H01L 51/0545 (2013.01); H01L 51/0558 (2013.01); H01L 51/42 (2013.01); H01L 51/5012 (2013.01); H01L 51/5056 (2013.01); H01L 51/5072 (2013.01); H01L 51/5092 (2013.01); H01L 51/56 (2013.01); H01L 2251/5338 (2013.01); H01L 2251/556 (2013.01); H01L 2251/558 (2013.01); Y02E 10/549 (2013.01); Y02P 70/521 (2015.11);
Abstract

A method for manufacturing an organic electronic element according to one embodiment includes: a hole injection layer coating film formation step of applying a hole injection layer coating liquid containing a material having an electron-accepting property on a plastic substrateto form a hole injection layer coating film; and a heat treatment step of heating the hole injection layer coating film by irradiating the hole injection layer coating film with an infrared ray to form a hole injection layer. The hole injection layer coating film has absorption in a first wavelength range of 1.2 μm to 5.0 μm, and the infrared ray is an infrared ray in which 80% or more of total radiation energy of the infrared ray in a wavelength range of 1.2 μm to 10.0 μm is included in the first wavelength range.

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