The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Jul. 12, 2018
Applicant:

Ngk Spark Plug Co., Ltd., Nagoya-shi, Aichi, JP;

Inventor:

Masahito Morita, Nagoya, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/54 (2010.01); H01L 21/48 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); H01L 21/48 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01);
Abstract

A light-emitting-element mounting package includes a substrate including front and back surfaces, a lead pin disposed at the back surface of the substrate, and a ceramic plate including an opposing front surface that opposes the back surface of the substrate and an opposing back surface. The substrate has a first through hole that extends therethrough. The ceramic plate has a second through hole that extends therethrough. Conductive portions extend continuously within the second through hole and around openings of the second through hole in the opposing front and back surfaces. A flange portion of the lead pin is joined to the conductive portion at the opposing back surface. A conductive member is joined to the conductive portion at the opposing front surface. The ceramic plate is joined to the back surface of the substrate with a portion of the conductive member disposed in the first through hole.


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