The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Aug. 08, 2014
Applicants:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Karoline Bernhard-hofer;

Inventors:

Frank Möllmer, Matting Bei Pentling, DE;

Markus Arzberger, Regensburg, DE;

Michael Schwind, Sinzing, DE;

Thomas Höfer, Lappersdorf, DE;

Martin Haushalter, Regensburg, DE;

Mario Wiengarten, Wörth, DE;

Tilman Eckert, Penang, MY;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 33/58 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 25/16 (2006.01); H01L 29/861 (2006.01); H01L 33/54 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 21/4817 (2013.01); H01L 21/4821 (2013.01); H01L 24/97 (2013.01); H01L 25/165 (2013.01); H01L 25/167 (2013.01); H01L 29/861 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 33/647 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49113 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/181 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01);
Abstract

An embodiment optoelectronic semiconductor device includes a housing having a leadframe with a first and second connection conductor. The housing further has a housing body surrounding the leadframe in one or more regions. The housing body extends in a vertical direction between a mounting side of the housing body and a front side of the housing body opposite the mounting side. The first connection conductor has a recess. A semiconductor chip configured to generate radiation is arranged within the housing, and the semiconductor chip is disposed in the recess and is affixed to the first connection conductor within the recess. A side face of the recess forms a reflector for reflecting the generated radiation. The first connection conductor protrudes from the housing body at the mounting side. The semiconductor chip is, in at least some regions, free of an encapsulation material adjoining the semiconductor chip.


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