The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

May. 25, 2017
Applicant:

Silergy Semiconductor Technology (Hangzhou) Ltd., Hangzhou, CN;

Inventors:

Junli Shentu, Hangzhou, CN;

Jiaming Ye, Hangzhou, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/167 (2006.01); H01L 31/0216 (2014.01); H01L 31/0203 (2014.01); H01L 31/02 (2006.01); H01L 31/18 (2006.01); G01J 5/10 (2006.01); G01J 1/42 (2006.01); G01J 1/02 (2006.01); G01J 1/04 (2006.01); H01L 31/00 (2006.01);
U.S. Cl.
CPC ...
H01L 31/167 (2013.01); G01J 1/0209 (2013.01); G01J 1/0214 (2013.01); G01J 1/0271 (2013.01); G01J 1/0488 (2013.01); G01J 1/4204 (2013.01); G01J 5/10 (2013.01); H01L 31/00 (2013.01); H01L 31/0203 (2013.01); H01L 31/02005 (2013.01); H01L 31/02165 (2013.01); H01L 31/18 (2013.01);
Abstract

A package structure and a method for manufacturing the same are disclosed. The package structure includes a first plastic body which covers a first light sensor and a light emitter, and a second plastic body which is made of infrared cutoff materials and fills inner pins of a lead frame or is formed below the lead frame. A trench is formed in the first plastic body so that a light-blocking layer is located on a side surface of the first plastic body. The second plastic body and the light-blocking layer are used to avoid influence of infrared light on a first light sensor.


Find Patent Forward Citations

Loading…