The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Jun. 26, 2018
Applicant:

Alpha and Omega Semiconductor, Inc., Sunnyvale, CA (US);

Inventors:

TingGang Zhu, Cupertino, CA (US);

Anup Bhalla, Santa Clara, CA (US);

Ping Huang, Shanghai, CN;

Yueh-Se Ho, Sunnyvale, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/872 (2006.01); H01L 29/66 (2006.01); H01L 25/18 (2006.01); H01L 29/861 (2006.01); H01L 29/20 (2006.01); H01L 29/40 (2006.01); H01L 21/02 (2006.01); H01L 21/306 (2006.01); H01L 21/311 (2006.01); H01L 27/02 (2006.01); H01L 29/06 (2006.01); H01L 21/285 (2006.01); H01L 29/417 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 27/08 (2006.01);
U.S. Cl.
CPC ...
H01L 29/872 (2013.01); H01L 21/0217 (2013.01); H01L 21/0254 (2013.01); H01L 21/28581 (2013.01); H01L 21/30612 (2013.01); H01L 21/31111 (2013.01); H01L 25/18 (2013.01); H01L 27/0248 (2013.01); H01L 29/0619 (2013.01); H01L 29/0688 (2013.01); H01L 29/2003 (2013.01); H01L 29/402 (2013.01); H01L 29/405 (2013.01); H01L 29/417 (2013.01); H01L 29/66136 (2013.01); H01L 29/66143 (2013.01); H01L 29/66212 (2013.01); H01L 29/861 (2013.01); H01L 29/8611 (2013.01); H01L 21/56 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 27/0814 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05016 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/11616 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13021 (2013.01); H01L 2224/13022 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01);
Abstract

A method for forming a nitride-based Schottky diode includes forming a nitride-based epitaxial layer on a front side of a nitride-based semiconductor body; forming a first dielectric layer on the nitride-based epitaxial layer; etching the first dielectric layer and the nitride-based epitaxial layer to the nitride-based semiconductor body to define an opening for an anode electrode of the nitride-based Schottky diode and to form an array of islands of the nitride-based epitaxial layer in the opening, the first dielectric layer having an end that is recessed from an end of the nitride-based epitaxial layer near the opening. In another embodiment, the first dielectric layer and the nitride-based epitaxial layer have a slant profile at a side facing the opening for the anode electrode.


Find Patent Forward Citations

Loading…