The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2019
Filed:
Mar. 09, 2017
Applicant:
Ams Ag, Unterpremstaetten, AT;
Inventors:
Assignee:
ams AG, Unterpremstaetten, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 23/00 (2006.01); H01L 31/0296 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1469 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14661 (2013.01); H01L 27/14663 (2013.01); H01L 27/14696 (2013.01); H01L 31/0296 (2013.01); H01L 31/02966 (2013.01); H01L 2924/14 (2013.01); H01L 2924/37001 (2013.01);
Abstract
The semiconductor device comprises a semiconductor wafer with an integrated circuit, formed by a plurality of dies, a further semiconductor wafer, which differs from the semiconductor wafer in diameter and semiconductor material, the semiconductor wafer and the further semiconductor wafer being bonded to one another by means of a bonding layer, and an electrically conductive contact layer arranged on the further semiconductor wafer opposite to the bonding layer.