The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Nov. 28, 2017
Applicant:

Elwha Llc, Bellevue, WA (US);

Inventors:

Erik E. Josberger, Seattle, WA (US);

Gleb M. Akselrod, Durham, NC (US);

Mark C. Weidman, Bellevue, WA (US);

Assignee:

Elwha LLC, Bellevue, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/146 (2006.01); G02F 1/29 (2006.01); G02B 5/18 (2006.01); G03H 1/04 (2006.01); H04N 5/225 (2006.01); H04N 5/374 (2011.01); G01S 7/481 (2006.01); H01Q 1/38 (2006.01); H01Q 3/44 (2006.01); H01Q 15/02 (2006.01); G01S 17/10 (2006.01); G01S 17/42 (2006.01); G01S 17/89 (2006.01); G02F 1/01 (2006.01); G02F 1/1339 (2006.01); G02F 1/1341 (2006.01); H01J 37/317 (2006.01); H01J 37/32 (2006.01); B29D 11/00 (2006.01); B82Y 20/00 (2011.01); G03H 1/00 (2006.01); H01Q 15/00 (2006.01); H01Q 15/14 (2006.01); G02F 1/1334 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14625 (2013.01); B29D 11/00326 (2013.01); B82Y 20/00 (2013.01); G01S 7/4813 (2013.01); G01S 7/4817 (2013.01); G01S 17/10 (2013.01); G01S 17/42 (2013.01); G01S 17/89 (2013.01); G02B 5/1809 (2013.01); G02F 1/0107 (2013.01); G02F 1/1339 (2013.01); G02F 1/1341 (2013.01); G02F 1/292 (2013.01); G03H 1/00 (2013.01); G03H 1/0443 (2013.01); H01J 37/3174 (2013.01); H01J 37/32816 (2013.01); H01L 27/14643 (2013.01); H01Q 1/38 (2013.01); H01Q 3/44 (2013.01); H01Q 15/02 (2013.01); H04N 5/2253 (2013.01); H04N 5/374 (2013.01); G02F 1/13342 (2013.01); G02F 2202/103 (2013.01); G02F 2202/30 (2013.01); G02F 2202/36 (2013.01); H01J 2237/334 (2013.01); H01Q 15/002 (2013.01); H01Q 15/0066 (2013.01); H01Q 15/148 (2013.01);
Abstract

A hologram system may include a hologram chip comprising a wafer substrate having a first plurality of conductive pads on a hologram surface region connected to a second plurality of conductive pads on an interconnect surface region. The hologram chip may also include an array of sub-wavelength hologram elements integrated with a refractive index tunable core material on the hologram region of the wafer substrate. The hologram system may also include a control circuit chip having a third plurality of conductive pads connected to the second plurality of conductive pads on the interconnect region of the wafer substrate. The interconnect region is on the same side of the wafer substrate as the hologram region. The first plurality of conductive pads is directly connected to the array of sub-wavelength hologram elements.


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