The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2019
Filed:
Sep. 14, 2017
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Ralf Siemieniec, Villach, AT;
Daniel Kueck, Villach, AT;
Gilberto Curatola, Villach, AT;
Romain Esteve, Villach, AT;
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8258 (2006.01); H01L 27/06 (2006.01); H01L 29/16 (2006.01); H01L 29/808 (2006.01); H01L 29/66 (2006.01); H01L 29/205 (2006.01); H01L 29/778 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0688 (2013.01); H01L 21/8258 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/66068 (2013.01); H01L 29/66462 (2013.01); H01L 29/7787 (2013.01); H01L 29/8083 (2013.01);
Abstract
A first semiconductor body including type IV semiconductor material is provided. A second semiconductor body including type III-V semiconductor material is provided. A first adhesion layer is formed on the first semiconductor body. A second adhesion layer is formed on the second semiconductor body. The first and the second semiconductor bodies are bonded together by adhering the first and the second adhesion layers to one another.