The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2019
Filed:
Mar. 07, 2017
Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Doo Hwan Lee, Suwon-si, KR;
Ju Hyeon Kim, Suwon-si, KR;
Dae Kyu Ahn, Suwon-si, KR;
Sung Won Jeong, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-do, KR;
Abstract
A fan-out semiconductor package includes a first connection member having a through hole, a semiconductor chip in the through hole, having an active surface with a connection pad and an inactive surface on an opposing side. An encapsulant encapsulates at least a portion of the first connection member and the semiconductor chip. A second connection member is on the first connection member and the semiconductor chip. The first connection member and the second connection member each include a redistribution layer electrically connected to a connection pad of the semiconductor chip. The interface between the second connection member and the encapsulant is located on a different level from the level of the interface between the second connection member and a redistribution layer of the first connection member or the level of the interface between the second connection member and a connection pad of the semiconductor chip.