The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2019
Filed:
Apr. 09, 2018
Applicant:
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi, JP;
Inventor:
Naoya Take, Toyota, JP;
Assignee:
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota-shi, Aichi-ken, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/09 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/02175 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/0612 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/48824 (2013.01); H01L 2224/49175 (2013.01);
Abstract
A semiconductor device may include a semiconductor substrate, a first bonding pad provided on an upper surface of the semiconductor substrate and constituted of a metal including aluminum, a second bonding pad provided on the upper surface of the semiconductor substrate, and a first protrusion protruding from an upper surface of the first bonding pad. The first protrusion may be provided on the upper surface of the first bonding pad only at a position adjacent to a peripheral edge of the first bonding pad, the peripheral edge of the first bonding pad may be opposed to the second bonding pad.