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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10332816 B1

PDFFull Text
Expired
Date of Patent:
Jun. 25, 2019

Filed:

Mar. 18, 2015

Circuit device and method of manufacturing the same

Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventor:

Hideyuki Sakamoto, Ota, JP;

Assignee:

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);

Attorney:

IPTechLaw

Primary Examiner:

Philip C Tucker

Assistant Examiner:

Jimmy R Smith, Jr

Int. Cl.
CPC ...
H05K 3/28 (2006.01); B29C 45/14 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); B29L 31/34 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3107 (2013.01); B29C 45/14008 (2013.01); B29C 45/14819 (2013.01); H01L 21/565 (2013.01); H05K 3/284 (2013.01); B29L 2031/3425 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/19105 (2013.01); H05K 3/0052 (2013.01); H05K 3/0097 (2013.01); H05K 2201/09154 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1545 (2013.01);
Abstract

Provided is a circuit device in which encapsulating resin to encapsulate a circuit board is optimized in shape, and a method of manufacturing the circuit device. A hybrid integrated circuit device, which is a circuit device according to the present invention includes a circuit board, a circuit element mounted on a top surface of the circuit board, and encapsulating resin encapsulating the circuit element, and coating the top surface, side surfaces, and a bottom surface of the circuit board. In addition, the encapsulating resin is partly recessed and thereby provided with recessed areas at two sides of the circuit board. The providing of the recessed areas reduces the amount of resin to be used, and prevents the hybrid integrated circuit device from being deformed by the cure shrinkage of the encapsulating resin.

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Sakamoto, Hideyuki. (2019). Circuit device and method of manufacturing the same (U.S. Patent No. 10332816). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10332816

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