The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Oct. 30, 2017
Applicant:

Avago Technologies General Ip (Singapore) Pte. Ltd., Singapore, SG;

Inventors:

Thomas Edward Dungan, Fort Collins, CO (US);

Jonathan Kwadwo Abrokwah, Fort Collins, CO (US);

Forest Dixon, Timnath, CO (US);

William Snodgrass, Fort Collins, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/06 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/732 (2006.01); H01L 21/8234 (2006.01); H01L 21/8249 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/8249 (2013.01); H01L 21/823481 (2013.01); H01L 27/0623 (2013.01); H01L 29/0813 (2013.01); H01L 29/1004 (2013.01); H01L 29/66287 (2013.01); H01L 29/66666 (2013.01); H01L 29/7322 (2013.01); H01L 29/7827 (2013.01);
Abstract

A transistor module includes a substrate; a transistor on the substrate; a dielectric layer disposed over the transistor and the substrate; a metal layer disposed over the dielectric layer and the transistor, the metal layer contacting a portion of the transistor; a metal pillar disposed over the metal layer; and a dielectric cushion disposed between the metal layer and the metal pillar over the transistor. The dielectric cushion includes dielectric material that is softer than the metal pillar, for reducing strain on semiconductor junctions when at least one of tensile or compressive stress is exerted on the metal pillar with respect to the substrate. The transistor module may further include at least one buttress formed between the metal layer and the substrate, adjacent to the transistor, for further reducing strain on the semiconductor junctions by providing at least one corresponding alternative stress path that substantially bypasses the transistor.


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