The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Aug. 23, 2016
Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventors:

Tomoyuki Minami, Handa, JP;

Kazuhiro Nobori, Handa, JP;

Tetsuya Kawajiri, Handa, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); C04B 37/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6831 (2013.01); C04B 37/025 (2013.01); C04B 37/026 (2013.01); H01L 21/67098 (2013.01); H01L 21/67103 (2013.01); H01L 21/68757 (2013.01); H01L 21/68792 (2013.01); C04B 2237/121 (2013.01); C04B 2237/343 (2013.01); C04B 2237/405 (2013.01); C04B 2237/55 (2013.01); C04B 2237/597 (2013.01); C04B 2237/60 (2013.01); C04B 2237/68 (2013.01); C04B 2237/704 (2013.01); C04B 2237/708 (2013.01); C04B 2237/72 (2013.01); C04B 2237/86 (2013.01);
Abstract

In a step (a), a ceramic substrate, a brazing material including a metal having a large thermal expansion coefficient, a porous body having a smaller thermal expansion coefficient than the brazing material, and a feeding terminal are placed on a joint surface in such a way that a joint surface of the feeding terminal faces a joint surface of the ceramic substrate. In a step (b), the brazing material is fused to allow the brazing material to penetrate into the pores of the porous body. In this manner, a joint layer containing the brazing material and the porous body is formed, and the joint surface of the ceramic substrate and the joint surface of the feeding terminal are joined to each other through the joint layer.


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