The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2019
Filed:
Apr. 07, 2016
Applicants:
Hyesun Yoon, Anyang-si, KR;
Geunwoo Kim, Asan-si, KR;
Youngjun Park, Asan-si, KR;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/481 (2013.01); H05K 3/0052 (2013.01); H01L 21/486 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/562 (2013.01); H05K 3/4602 (2013.01); H05K 2201/0909 (2013.01); H05K 2201/09036 (2013.01);
Abstract
A package substrate includes a core portion comprising a first surface and a second surface arranged opposite to each other; first cutting regions provided to penetrate at least a portion of the core portion in a thickness direction; a first upper circuit pattern disposed on the first surface of the core portion; and an insulating layer provided to cover the first surface of the core portion and to fill the first cutting regions. The first cutting regions are spaced apart from each other in a first direction that is substantially parallel to one side of the core portion.