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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10332679 B1

PDFFull Text
Date of Patent:
Jun. 25, 2019

Filed:

Feb. 26, 2018

Surface mount electronic component

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Takashi Yamamoto, Nagaokakyo, JP;

Jinya Furui, Nagaokakyo, JP;

Takashi Inoue, Nagaokakyo, JP;

Yuji Fukada, Nagaokakyo, JP;

Masaki Fukuda, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Eric W Thomas

Int. Cl.
CPC ...
H01G 2/06 (2006.01); H01G 4/228 (2006.01); H01G 4/12 (2006.01); H01C 1/142 (2006.01); H01C 1/144 (2006.01); H01C 7/00 (2006.01); H01C 17/28 (2006.01); H01G 4/008 (2006.01); H01G 4/224 (2006.01); H01G 4/236 (2006.01); H01G 4/248 (2006.01); H01G 4/01 (2006.01);
U.S. Cl.
CPC ...
H01G 2/065 (2013.01); H01C 1/142 (2013.01); H01C 1/144 (2013.01); H01C 7/003 (2013.01); H01C 7/008 (2013.01); H01C 17/283 (2013.01); H01G 4/008 (2013.01); H01G 4/1218 (2013.01); H01G 4/1227 (2013.01); H01G 4/1272 (2013.01); H01G 4/224 (2013.01); H01G 4/236 (2013.01); H01G 4/248 (2013.01); H01G 4/01 (2013.01);
Abstract

A surface mount electronic component includes an element including a dielectric layer that includes a first main surface and a second main surface, a first external electrode disposed on the first main surface, a second external electrode disposed on the second main surface, a first metal terminal connected to the first external electrode by solder, a second metal terminal connected to the second external electrode by the solder, and an exterior material covering at least a portion of the element, the first and second external electrodes, and the first and second metal terminals. The solder satisfies a relational expression: element diameter D (mm)×about 0.003 mm≤solder cross-sectional area S (mm)≤element diameter D (mm)×about 0.02 mm.

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