The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2019
Filed:
Feb. 13, 2015
Applicant:
Cyntec Co., Ltd., Hsinchu, TW;
Inventors:
Wei-Chien Chang, Hsinchu County, TW;
Chia-Chi Wu, New Taipei, TW;
Lang-Yi Chiang, Keelung, TW;
Tsung-Chan Wu, Hsinchu, TW;
Jih-Hsu Yeh, Taipei, TW;
Assignee:
CYNTEC CO., LTD., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 5/02 (2006.01); H01F 5/00 (2006.01); H01F 27/29 (2006.01); H01F 41/04 (2006.01); H01F 17/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 5/003 (2013.01); H01F 5/02 (2013.01); H01F 27/292 (2013.01); H01F 41/04 (2013.01); H01F 2017/048 (2013.01); H01F 2027/2809 (2013.01); Y10T 29/49002 (2015.01); Y10T 29/4902 (2015.01); Y10T 29/49071 (2015.01); Y10T 29/49073 (2015.01); Y10T 29/49075 (2015.01);
Abstract
An electromagnetic component includes a coil portion with a multi-layer stack structure, a molded body encapsulating the coil portion, and two electrodes respectively coupled to two terminals of the coil portion. The coil portion is fabricated using plating, laminating and/or pressing manufacturing techniques.