The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2019
Filed:
Dec. 13, 2013
Nippon Steel & Sumitomo Metal Corporation, Tokyo, JP;
NIPPON STEEL & SUMITOMO METAL CORPORATION, Tokyo, JP;
Abstract
The deformation analysis device includes: a storage unit () which stores analysis data of a material; a state variable calculating unit () which calculates stresses and other state variables of respective elements of the material at each point in time of deformation of the material, based on the analysis data; a fracture determining unit () which, based on the calculated state variables, determines whether or not a fracture has occurred in each of the elements of the material, based on a fracture limit stress curve which is found in advance for the material; and a stress correcting unit () which, regarding an element in which it is determined that the fracture has occurred, out of the elements of the material, reduces σ by the following expression σ=(1−D)σ' where σ is a stress with a rigidity decrease taken into consideration, D is a damage variable (note that 0≤D≤1) in continuum damage mechanics, and σ′ is a stress with the rigidity decrease not taken into consideration, to thereby decrease rigidity of the relevant element, without eliminating the element, and updates the analysis data.