The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Feb. 24, 2017
Applicant:

Wuhan China Star Optoelectronics Technology Co., Ltd., Wuhan, CN;

Inventor:

Yuanfu Liu, Wuhan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1368 (2006.01); G02F 1/1362 (2006.01); H01L 29/786 (2006.01); H01L 29/66 (2006.01); H01L 21/265 (2006.01); H01L 21/266 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
G02F 1/1368 (2013.01); G02F 1/136227 (2013.01); H01L 21/266 (2013.01); H01L 21/26513 (2013.01); H01L 27/1288 (2013.01); H01L 29/66757 (2013.01); H01L 29/66765 (2013.01); H01L 29/78621 (2013.01); H01L 29/78633 (2013.01); G02F 2001/136231 (2013.01); G02F 2202/104 (2013.01);
Abstract

A manufacturing method of a TFT substrate uses a bottom gate structure and the entire process can be completely done with seven masks. The number of masks used is reduced. The manufacturing process of a TFT substrate is simplified. Product yield and increase productivity are effectively improved. By subjecting two ends of a semiconductor pattern to heavy ion doping to form a source electrode and a drain electrode, the manufacturing steps can be reduced and the source electrode and the drain electrode so formed do not need to extend through a via hole formed in an interlayer dielectric layer to get in connection with the two ends of the active layer so as to effectively reduce contact resistance and improve product yield. Also provided is a TFT substrate manufactured with the method.


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