The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Apr. 15, 2015
Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, JP;

Inventor:

Katsuyuki Uematsu, Hata-machi, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasahi-Shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 19/00 (2006.01); G01L 9/00 (2006.01); G01L 19/06 (2006.01); H05K 13/00 (2006.01); H01L 23/057 (2006.01); H01L 23/00 (2006.01); H01L 23/24 (2006.01);
U.S. Cl.
CPC ...
G01L 19/0084 (2013.01); G01L 9/0052 (2013.01); G01L 19/0069 (2013.01); G01L 19/0654 (2013.01); H01L 23/057 (2013.01); H01L 24/85 (2013.01); H05K 13/00 (2013.01); H01L 23/24 (2013.01); H01L 24/05 (2013.01); H01L 24/45 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01); H01L 2224/85444 (2013.01); H01L 2924/181 (2013.01); Y10T 29/49171 (2015.01);
Abstract

In aspects of the invention, a sensor unit is stored in a recessed sensor mount portion formed in a resin case. The sensor unit can be formed so that a semiconductor pressure sensor chip is joined to one side of a glass pedestal, and the other side of the glass pedestal is die-bonded to the bottom of the sensor mount portion through an adhesive. An electrode pad on the semiconductor pressure sensor chip is electrically connected through a bonding wire to a lead terminal for leading externally that pierces through the resin case and is integrally insert-molded therein. An entire surface of the sensor unit, an exposed part of the lead terminal internally-located in the resin case, the bonding wire, and an exposed part of an inner wall of the resin case can be coated with the protective film composed of a poly(p-xylylene)-family polymer including fluorine.


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