The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Aug. 22, 2017
Applicant:

Honeywell International Inc., Morris Plains, NJ (US);

Inventors:

James F. Machir, Columbus, OH (US);

Richard Wade, Worthington, OH (US);

Jason Dennis Patch, Columbus, OH (US);

Assignee:

Honeywell International Inc., Morris Plains, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 1/18 (2006.01); G01L 1/16 (2006.01); G01L 1/22 (2006.01); G01L 5/00 (2006.01); G01L 5/16 (2006.01); H01L 41/08 (2006.01);
U.S. Cl.
CPC ...
G01L 1/162 (2013.01); G01L 1/18 (2013.01); G01L 1/2293 (2013.01); G01L 5/0019 (2013.01); G01L 5/167 (2013.01); H01L 41/08 (2013.01);
Abstract

A force sensor or sensor assembly may include a sense die, a housing, and a force transmitting member. The sense die may include a force sensing region and at least one bond pad. The housing may include a sense die receiving cavity, at least one electrical terminal configured to engage a bond pad of the sense die, a retention member configured to prevent the sense die from sliding out of the housing, and a hole in the housing that exposes the force sensing region of the sense die to the force transmitting element. The housing may include one or more component parts. In some cases, the force sensor or sensor assembly may be configured on a microscale through micro-manufacturing techniques.


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