The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Oct. 18, 2016
Applicant:

National Institute of Advanced Industrial Science and Technology, Tokyo, JP;

Inventor:

Keiko Masumoto, Ibaraki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C30B 25/18 (2006.01); C30B 29/36 (2006.01); C23C 16/32 (2006.01); C30B 25/16 (2006.01); C30B 25/20 (2006.01); C30B 33/10 (2006.01); H01L 21/306 (2006.01); H01L 21/324 (2006.01); H01L 29/04 (2006.01); H01L 29/16 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
C30B 25/186 (2013.01); C23C 16/325 (2013.01); C30B 25/165 (2013.01); C30B 25/20 (2013.01); C30B 29/36 (2013.01); C30B 33/10 (2013.01); H01L 21/0259 (2013.01); H01L 21/0262 (2013.01); H01L 21/02378 (2013.01); H01L 21/02433 (2013.01); H01L 21/02529 (2013.01); H01L 21/02658 (2013.01); H01L 21/3065 (2013.01); H01L 21/30604 (2013.01); H01L 21/30625 (2013.01); H01L 21/324 (2013.01); H01L 21/3247 (2013.01); H01L 29/045 (2013.01); H01L 29/1608 (2013.01); Y10T 428/24529 (2015.01);
Abstract

A subject of present invention is to enable reducing, even in growth at a high C/Si ratio, contamination by different polytypes with respect to a silicon carbide epitaxial wafer having a low off-angle, and to provide the silicon carbide epitaxial wafer which enables forming a reliable high voltage silicon carbide semiconductor element. The silicon carbide epitaxial wafer of the present invention is a silicon carbide epitaxial wafer comprising an epitaxially grown layer disposed on a silicon carbide substrate having an α-type crystal structure and an off-angle tilted at an angle of more than 0° and less than 4° from a (0001) Si plane or a (000-1) C plane, wherein a region of a step bunching including five to ten bunched steps of 1 nm in height occupies 90% or more of the surface of the silicon carbide substrate.


Find Patent Forward Citations

Masumoto, Keiko. (2019). Silicon carbide epitaxial wafer and process for producing same (U.S. Patent No. 10329689). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10329689

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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