The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Jul. 12, 2017
Applicants:

Mind Technology Development Limited, Hong Kong, HK;

New Asia Group Holdings Limited, Hong Kong, HK;

Inventors:

Chung Pui Chan, Hong Kong, HK;

Lai Fan Lai, Hong Kong, HK;

Wing Hong Choi, Hong Kong, HK;

Bin Zhang, Hong Kong, HK;

Kwok Keung Paul Ho, Hong Kong, HK;

Chien Chung, Hong Kong, HK;

Chun Pong Lee, Hong Kong, HK;

Assignees:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 4/06 (2016.01); C23C 14/16 (2006.01); C09D 133/02 (2006.01); H01B 1/22 (2006.01); C25D 5/02 (2006.01); C08K 3/08 (2006.01); C25D 5/54 (2006.01); C25D 7/12 (2006.01); H01L 51/42 (2006.01); H01L 31/0224 (2006.01); H01L 31/05 (2014.01); H05K 3/20 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
C23C 14/16 (2013.01); C08K 3/08 (2013.01); C09D 133/02 (2013.01); C23C 4/06 (2013.01); C25D 5/022 (2013.01); C25D 5/54 (2013.01); C25D 7/12 (2013.01); H01B 1/22 (2013.01); H01L 31/022425 (2013.01); H01L 31/0516 (2013.01); H01L 51/003 (2013.01); H01L 51/0023 (2013.01); H01L 51/0097 (2013.01); H01L 51/42 (2013.01); H05K 3/207 (2013.01); C08K 2003/0806 (2013.01); Y02E 10/549 (2013.01);
Abstract

The present invention provides a transparent conductive thin film which is flexible for suiting substantially all kinds of electronic and optoelectronic devices or display panel. The present conductive thin film includes at least one transparent substrate, a deformable layer and a conductive network pattern having a high aspect ratio such that at least one surface of the conductive network being exposed out of the deformable layer or the transparent substrate for contacting with an external structure while a large proportion thereof stays firmly integrated into the substrate. The present invention also relates to methods of fabricating a transparent conductive thin film including the structural features of the transparent conductive thin film of the present invention. Various optimizations of the present methods are also provided in the present invention for facilitating large area thin film fabrication and large scale production.


Find Patent Forward Citations

Loading…