The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2019
Filed:
Feb. 03, 2015
Applicant:
Dongwoo Fine-chem Co., Ltd., Jeollabuk-do, KR;
Inventors:
Han Young Choi, Gyeonggi-do, KR;
Ju Yeol Jang, Gyeonggi-do, KR;
Assignee:
DONGWOO FINE-CHEM CO., LTD., Jeollabuk-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/38 (2018.01); C08K 5/544 (2006.01); C09J 11/06 (2006.01); C09J 133/04 (2006.01); G02B 5/30 (2006.01); C08F 220/18 (2006.01); C09J 7/00 (2018.01); C09J 133/06 (2006.01); C08F 265/06 (2006.01); C09J 4/06 (2006.01); C09J 133/08 (2006.01); C09J 7/22 (2018.01); C08K 5/5465 (2006.01);
U.S. Cl.
CPC ...
C09J 11/06 (2013.01); C08F 220/18 (2013.01); C08F 265/06 (2013.01); C09J 4/06 (2013.01); C09J 7/00 (2013.01); C09J 7/22 (2018.01); C09J 7/38 (2018.01); C09J 133/04 (2013.01); C09J 133/06 (2013.01); C09J 133/08 (2013.01); G02B 5/30 (2013.01); C08F 2220/1825 (2013.01); C08F 2500/26 (2013.01); C08F 2800/20 (2013.01); C08K 5/544 (2013.01); C08K 5/5442 (2013.01); C08K 5/5465 (2013.01); C09J 2203/318 (2013.01); C09J 2205/102 (2013.01); C09J 2205/114 (2013.01); C09J 2433/00 (2013.01); G02B 5/3033 (2013.01);
Abstract
An adhesive composition includes an acryl copolymer having a carboxyl group, and a silane compound represented by Formula 1 or 2, thereby it is possible to exhibit excellent initial adhesiveness and adhesive durability under severe conditions, and prevent the substrate from being torn due to a decrease in adhesiveness by water applied thereto, and the adhesive from remaining on the substrate during peeling-off the adhesive layer, as well as after drying, the adhesive layer may exhibit favorable adhesiveness again, thus being used for re-bonding.