The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2019
Filed:
Mar. 28, 2016
Encapsulated device of semiconductor material with reduced sensitivity to thermo-mechanical stresses
Applicant:
Stmicroelectronics S.r.l., Agrate Brianza, IT;
Inventors:
Alessandro Tocchio, Milan, IT;
Carlo Valzasina, Gessate, IT;
Luca Guerinoni, Premolo, IT;
Giorgio Allegato, Monza, IT;
Assignee:
STMicroelectronics S.r.l., Agrate Brianza, IT;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/13 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 23/055 (2006.01); H01L 23/16 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0048 (2013.01); B81C 1/00325 (2013.01); H01L 23/055 (2013.01); H01L 23/13 (2013.01); H01L 23/16 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48235 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/3511 (2013.01);
Abstract
An encapsulated device of semiconductor material wherein a chip of semiconductor material is fixed to a base element of a packaging body through at least one pillar element having elasticity and deformability greater than the chip, for example a Young's modulus lower than 300 MPa. In one example, four pillar elements are fixed in proximity of the corners of a fixing surface of the chip and operate as uncoupling structure, which prevents transfer of stresses and deformations of the base element to the chip.