The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

May. 27, 2015
Applicants:

Compagnie Generale Des Etablissements Michelin, Clermont-Ferrand, FR;

Michelin Recherche ET Technique S.a., Granges-Paccot, CH;

Inventors:

Hichem Rehab, Clermont-Ferrand, FR;

Jean-François Parmentier, Clermont-Ferrand, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B60C 9/18 (2006.01); B60C 9/20 (2006.01); C08K 13/02 (2006.01); C08L 7/00 (2006.01); B60C 1/00 (2006.01);
U.S. Cl.
CPC ...
B60C 9/185 (2013.01); B60C 9/1835 (2013.01); B60C 9/2006 (2013.01); C08K 13/02 (2013.01); C08L 7/00 (2013.01); B60C 2001/0066 (2013.01); B60C 2001/0075 (2013.01); B60C 2009/1878 (2013.01); B60C 2009/2061 (2013.01); B60C 2009/2064 (2013.01);
Abstract

Tire comprising a crown reinforcement formed of at least two working crown layers of reinforcing elements, a first layer C of rubber compound being placed between at least the ends of the said at least two working crown layers, a second layer S of polymer compound being in contact with at least one working crown layer and in contact with the carcass reinforcement and the crown reinforcement comprising at least one layer of circumferential reinforcing elements. The elastic modulus under tension at 10% elongation of the first layer C is less than 8 MPa, the maximum tan(δ) value, denoted tan(δ), of the first layer C is less than 0.100, and the complex dynamic shear modulus G*, measured at 10% and 60° C. on the return cycle, of the said second layer S of polymer compound is greater than 1.35 MPa.


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