The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Nov. 19, 2014
Applicant:

Borealis Ag, Vienna, AT;

Inventors:

Auli Nummila-Pakarinen, Porvoo, FI;

Peter Niedersuess, Ried/Riedmark, AT;

Assignee:

BOREALIS AG, Vienna, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/32 (2006.01); B29C 48/00 (2019.01); B29C 55/06 (2006.01); B29K 23/00 (2006.01);
U.S. Cl.
CPC ...
B32B 27/32 (2013.01); B29C 48/0018 (2019.02); B29C 55/06 (2013.01); B32B 27/327 (2013.01); B29K 2023/0625 (2013.01); B29K 2995/0051 (2013.01); B29K 2995/0081 (2013.01); B32B 2250/03 (2013.01); B32B 2250/242 (2013.01); B32B 2270/00 (2013.01); B32B 2307/516 (2013.01); B32B 2307/558 (2013.01); B32B 2307/5825 (2013.01); B32B 2439/46 (2013.01); B32B 2439/70 (2013.01); B32B 2439/80 (2013.01);
Abstract

A multilayer machine direction oriented film comprising at least an (A) layer and (B) layer, at least one of said (A) layer or (B) layer comprising at least 50 wt % of a multimodal linear low density polyethylene (LLDPE) having a density of 905 to 940 kg/mand an MFRof 0.01 to 20 g/10 min and comprising a lower molecular weight (LMW) component and a higher molecular weight (HMW) component; wherein said LMW component is an ethylene homopolymer and said HMW component is an ethylene polymer of ethylene with at least two C4-12 alpha olefins; wherein said film is a stretched film which is uniaxially oriented in the machine direction (MD) in a draw ratio of at least 1:3 and has a film thickness of at least 40 microns (after stretching) and wherein said film does not comprise a layer in which more than 50 wt % of said layer comprises a polymer component having a melting point (Tm) of 100° C. or less.


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