The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2019
Filed:
Nov. 01, 2013
Applicant:
Richard W. Roberts, Tecumseh, MI (US);
Inventor:
Richard W. Roberts, Tecumseh, MI (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/24 (2006.01); B32B 3/26 (2006.01); B32B 5/18 (2006.01); B32B 5/20 (2006.01); B32B 7/08 (2019.01); B32B 25/16 (2006.01); B32B 27/06 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 3/28 (2006.01); B60N 2/68 (2006.01); B32B 7/05 (2019.01);
U.S. Cl.
CPC ...
B32B 3/266 (2013.01); B32B 3/28 (2013.01); B32B 5/18 (2013.01); B32B 5/20 (2013.01); B32B 7/05 (2019.01); B32B 7/08 (2013.01); B32B 25/16 (2013.01); B32B 27/065 (2013.01); B32B 27/302 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B60N 2/686 (2013.01); B32B 2266/025 (2013.01); B32B 2270/00 (2013.01); B32B 2307/738 (2013.01); Y10T 428/24281 (2015.01);
Abstract
An in-situ foam core component having first and second opposed thermoformed skins each having a thermal bond to an in-situ foam core disposed there between. At least one embossment In one of the skins joined to the other skin forming a pinch off junction. A through hole is formed in the pinch off junction sized to receive a fastener so that the embossment provides a sleeve structure which can transmit load between the first and second skins when the in-situ foam core component is attached to a member using a fastener extending through the hole.