The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Oct. 13, 2014
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Krishna B. Uibel, Waltenhofen, DE;

Robert Schädel, Kempten, DE;

Assignee:

3M INNOVATIVE PROPERTIES COMPANY, Saint Paul, MN (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/00 (2006.01); B29C 45/77 (2006.01); C08K 3/38 (2006.01); B29K 507/02 (2006.01); B29K 509/08 (2006.01); C08K 3/34 (2006.01); C08K 7/14 (2006.01);
U.S. Cl.
CPC ...
B29C 45/0013 (2013.01); B29C 45/77 (2013.01); C08K 3/38 (2013.01); B29C 2945/76531 (2013.01); B29C 2945/76545 (2013.01); B29C 2945/76765 (2013.01); B29K 2507/02 (2013.01); B29K 2509/08 (2013.01); C08K 3/34 (2013.01); C08K 7/14 (2013.01); C08K 2003/385 (2013.01);
Abstract

The invention relates to a method for producing a component part having a wall thickness of at most 3 mm on at least one part of the component part, comprising the method step of injection molding by means of an injection mold in an injection molding machine using a polymer/boron nitride compound, wherein the polymer/boron nitride compound comprises a thermoplastically processable polymer material and a heat-conducting filler, wherein the filler comprises platelet-shaped hexagonal boron nitride particles and wherein the injection rate during injection-molding is at most 200 mm/s. The invention further relates to a component part produced using such a method and a polymer/boron nitride compound for producing such a component part. The invention further relates to the use of such a component part for heat dissipation of component parts and assemblies to be cooled.


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