The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Dec. 29, 2015
Applicant:

United Technologies Corporation, Hartford, CT (US);

Inventors:

Daniel A Bales, Avon, CT (US);

Thomas J Watson, South Windsor, CT (US);

Assignee:

United Technologies Corporation, Farmington, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 3/00 (2006.01); B22F 3/04 (2006.01); B22F 1/00 (2006.01); B32B 1/02 (2006.01); B32B 15/01 (2006.01); B32B 5/16 (2006.01); B22F 3/08 (2006.01);
U.S. Cl.
CPC ...
B22F 3/04 (2013.01); B22F 1/0003 (2013.01); B22F 3/08 (2013.01); B32B 1/02 (2013.01); B32B 5/16 (2013.01); B32B 15/01 (2013.01); B22F 2301/15 (2013.01); B22F 2301/205 (2013.01); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2264/105 (2013.01); B32B 2439/00 (2013.01);
Abstract

A dynamic compaction process comprises forming first and second preforms. Forming each preform includes utilizing a container having an interior and an exterior. Filling the interior of the container with a powder material; sealing the container; subjecting the exterior of the container to an instantaneous dynamic compaction, forming a solid powder metallurgy preform encased by the container. The container gets removed from each preform. The process includes inserting the first and second preforms in another container in a predefined pattern; the predefined pattern aligns the first and second preforms creating an interface. The process includes inserting a backstop against the predefined pattern in this container; subjecting the exterior of this container to an instantaneous dynamic compaction. The process includes bonding the first preform and second preform along the interface to form a component precursor; and removing the container from the precursor. Another step includes processing the precursor into components.


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