The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2019

Filed:

Feb. 20, 2013
Applicant:

Koninklijke Philips N.v., Eindhoven, NL;

Inventors:

Ronald Dekker, Valkenswaard, NL;

Vincent Adrianus Henneken, Utrecht, NL;

Marcel Mulder, Eindhoven, NL;

Assignee:

Koninklijke Philips N.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); A61B 18/00 (2006.01); A61B 1/00 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); A61B 1/05 (2006.01); A61B 8/12 (2006.01); A61B 18/14 (2006.01); A61N 1/36 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/32 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); A61B 1/0008 (2013.01); A61B 1/051 (2013.01); A61B 8/12 (2013.01); A61B 18/1492 (2013.01); A61N 1/36135 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/46 (2013.01); H01L 24/48 (2013.01); H01L 24/72 (2013.01); H01L 24/85 (2013.01); H05K 1/18 (2013.01); H05K 3/0094 (2013.01); H05K 3/32 (2013.01); A61B 2018/00577 (2013.01); A61B 2018/00714 (2013.01); A61B 2018/00791 (2013.01); H01L 29/0657 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05555 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/4824 (2013.01); H01L 2224/4847 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85365 (2013.01); H01L 2224/85801 (2013.01); H01L 2224/85815 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10155 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/181 (2013.01); Y10T 29/49169 (2015.01);
Abstract

The present invention relates to an electronic circuit arrangement () comprising: a substrate () having a first surface () and a second surface (), an electronic circuit, an electrical connection part () for providing an electrical connection to the electronic circuit and being arranged on the first surface (), and at least one electrical wire (). The electrical wire () comprises at least one conductive core () and an isolation () surrounding the conductive core (). An end portion () of the electrical wire () is an isolation-free portion for allowing access to the conductive core (), wherein the end portion () of the electrical wire () is connected to the electrical connection part (). At least one through-hole () extending from the first surface () to the second surface () is provided in the substrate (), wherein the electrical wire () is arranged through the through-hole ().


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