The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2019
Filed:
Jun. 21, 2016
Zkw Group Gmbh, Wieselburg, AT;
Erik Edlinger, Vienna, AT;
Dietmar Kieslinger, Theresienfeld, AT;
ZK W Group GmbH, Wieselburg, AT;
Abstract
A printed circuit board () comprising an insulating layer () and a conducting layer () arranged on the insulating layer () and structured into a contact surface () for an electronic component () which is to be populated on the printed circuit board () has, in the area of the contact surface (), at least one channel () that passes through the contact surface () and the insulating layer () and that is filled with a thermally conductive material. The process is characterized by the steps of preparing an insulating layer () and a conducting layer () connected with the insulating layer (); producing at least one channel () passing through the conducting layer () and the insulating layer (); lining the channel () with thermally conductive material; structuring the conducting layer () into a contact surface () for an electronic component () to be populated on the printed circuit board; preparing a solder deposit () at least minimally overlapping with the contact surface (); setting down the electronic component (); melting the solder, and cooling.