The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2019

Filed:

May. 14, 2015
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Nobuyuki Matsui, Fukushima, JP;

Makoto Ohno, Mie, JP;

Hiroyuki Yamada, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 1/03 (2006.01); H01L 23/36 (2006.01); H01L 23/367 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); H01L 23/36 (2013.01); H05K 1/0313 (2013.01); H05K 1/181 (2013.01); H01L 23/3677 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0201 (2013.01); H05K 1/0203 (2013.01); H05K 1/0206 (2013.01); H05K 1/0207 (2013.01); H05K 3/0061 (2013.01); H05K 2201/066 (2013.01);
Abstract

A circuit board includes a heat storage body, an insulating layer provided on the heat storage body, a wiring board provided on the insulating layer, and a heat generating component provided on the wiring board. The insulating layer is provided independently of the wiring board. The wiring board is provided with a heat transfer metal portion penetrating through the wiring board and facing the heat generating component. The insulating layer is provided with a heat transfer resin portion penetrating through the insulating layer and facing the heat transfer metal portion. The heat transfer resin portion and a part of the insulating layer are interposed between the heat transfer metal portion and the heat storage body.


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