The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2019
Filed:
Oct. 28, 2016
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Kensaku Isohata, Minowa-machi, JP;
Takayuki Kikuchi, Chino, JP;
Assignee:
SEIKO EPSON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03B 5/32 (2006.01); H03L 1/02 (2006.01); H03L 1/04 (2006.01); H01L 23/00 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
H03L 1/04 (2013.01); H01L 23/34 (2013.01); H01L 23/345 (2013.01); H01L 24/09 (2013.01); H01L 24/48 (2013.01); H03B 5/32 (2013.01); H03L 1/028 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/351 (2013.01); H03B 2200/001 (2013.01); H03B 2200/0008 (2013.01); H03B 2200/0012 (2013.01); H03B 2200/0018 (2013.01);
Abstract
An integrated circuit device includes a substrate, a joining part provided on the substrate and joined to a vibrator, and a plurality of bonding pads provided on the substrate. The joining part includes an insulating protective film that covers a part of a surface of the substrate, and no insulating protective film is provided between the adjacent bonding pads.