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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10326444 B1

PDFFull Text
Date of Patent:
Jun. 18, 2019

Filed:

Aug. 11, 2015

Integrated circuit device and electronic appliance

Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventor:

Isamu Moriya, Chino, JP;

Assignee:

SEIKO EPSON CORPORATION, Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Eduardo Colon Santana

Assistant Examiner:

Cortez M Cook

Int. Cl.
CPC ...
B62D 5/04 (2006.01); H02K 9/00 (2006.01); G06F 1/16 (2006.01); H02K 11/33 (2016.01); H03K 17/687 (2006.01); H02P 8/00 (2006.01); H01L 23/528 (2006.01); H01L 29/78 (2006.01); H01L 29/06 (2006.01); H01L 27/02 (2006.01); H01L 27/092 (2006.01); H01L 21/761 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H03K 17/6871 (2013.01); H01L 23/528 (2013.01); H01L 27/0203 (2013.01); H01L 27/0922 (2013.01); H01L 29/0619 (2013.01); H01L 29/7801 (2013.01); H02P 8/00 (2013.01); H01L 21/761 (2013.01); H01L 27/0207 (2013.01); H01L 29/0653 (2013.01); H01L 29/1083 (2013.01); H01L 29/1087 (2013.01); H01L 29/7816 (2013.01); H01L 29/7835 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An H-bridge pre-driver is configured as two blocks so as to suit the width of an H-bridge driver Tr. The two blocks are line-symmetrically placed with a bias circuit interposed therebetween. One of the pre-driver blocks is laid out as a rectangle that is long in one direction and is short in a direction perpendicular to that direction. With this configuration, the pre-driver layout area can be reduced, and the cost of IC can be reduced. Furthermore, the symmetric placement enables matching of the impedance of interconnect from the pre-driver to the driver and stabilization of properties to be achieved.

Find Patent Forward Citations

Moriya, Isamu. (2019). Integrated circuit device and electronic appliance (U.S. Patent No. 10326444). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10326444

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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