The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2019

Filed:

Apr. 26, 2018
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventor:

Toshishige Koreeda, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/00 (2006.01); H03H 9/02 (2006.01); H03H 9/05 (2006.01); H03H 9/25 (2006.01); H03H 9/64 (2006.01); H03H 9/72 (2006.01);
U.S. Cl.
CPC ...
H03H 9/0028 (2013.01); H03H 9/02992 (2013.01); H03H 9/059 (2013.01); H03H 9/0557 (2013.01); H03H 9/0576 (2013.01); H03H 9/25 (2013.01); H03H 9/6483 (2013.01); H03H 9/725 (2013.01); H03H 9/02559 (2013.01);
Abstract

A filter device includes a filter chip on a multilayer substrate. The filter chip includes a reception filter chip portion and a transmission filter chip portion, and a reception filter defined by a first bandpass filter includes first and second balanced output terminals. First and second balance wirings connect first and second balanced input pads and first and second balanced output pads provided on a second principal surface of the multilayer substrate. The first and second balance wirings cross each other within the multilayer substrate and are electrically insulated from each other. A portion of a ground conductor is disposed at a region in which the first and second balance wirings overlap, interposed between portions of the first and second balance wirings, and disposed at a different substrate layer.


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