The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2019

Filed:

Dec. 08, 2017
Applicant:

Hong Kong Beida Jade Bird Display Limited, Hong Kong, HK;

Inventors:

Wing Cheung Chong, Tseung Kwan O, HK;

Lei Zhang, Albuquerque, NM (US);

Fang Ou, Monterey Park, CA (US);

Qiming Li, Albuquerque, NM (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 25/16 (2006.01); H01L 33/62 (2010.01); H01L 33/00 (2010.01); H01L 27/15 (2006.01); H01L 33/08 (2010.01); H01L 25/075 (2006.01); H01L 27/12 (2006.01); H01L 33/32 (2010.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 27/15 (2013.01); H01L 33/00 (2013.01); H01L 33/0079 (2013.01); H01L 33/08 (2013.01); H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 27/124 (2013.01); H01L 27/1255 (2013.01); H01L 33/32 (2013.01); H01L 2933/0066 (2013.01);
Abstract

Mass transfer of micro structures are effected from one substrate to another using adhesives. In the context of an integrated micro LED display, a micro LED array is fabricated on a native substrate and corresponding CMOS pixel drivers are fabricated on a separate substrate. The micro LED substrate (e.g., sapphire) and the CMOS substrate (e.g., silicon) may be incompatible. For example, they may have different thermal coefficients of expansion which make it difficult to bond the micro LEDs to the pixel driver circuitry. The micro LED array is transferred to an intermediate substrate (e.g., silicon) by use of an adhesive. This intermediate substrate may be used in a process of bonding the micro LED array to the array of pixel drivers. The intermediate substrate is separated from the micro LED array by releasing the adhesive.


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