The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2019
Filed:
Aug. 11, 2016
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Sun Woo Park, Seoul, KR;
Myung Sub Kim, Seoul, KR;
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 25/075 (2006.01); G09F 9/33 (2006.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/52 (2010.01); H01L 33/58 (2010.01); H01L 33/62 (2010.01); H01L 33/30 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); G09F 9/33 (2013.01); H01L 33/00 (2013.01); H01L 33/48 (2013.01); H01L 33/50 (2013.01); H01L 33/52 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 33/0025 (2013.01); H01L 33/30 (2013.01); H01L 33/642 (2013.01); H01L 33/647 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48237 (2013.01); H01L 2224/49113 (2013.01);
Abstract
A light emitting element disclosed in an embodiment comprises: a support substrate having a plurality of pads and a black matrix layer outside the plurality of pads; a plurality of light emitting chips, at least one of which is disposed on at least one of the plurality of pads; and a light-transmitting resin layer which is disposed on the support substrate and covers the pads, the black matrix layer, and the light emitting chips.