The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2019

Filed:

Dec. 21, 2017
Applicant:

Macom Technology Solutions Holdings, Inc., Lowell, MA (US);

Inventors:

Emmanuelle R. O. Convert, Cammeray, AU;

Ryan M. Clement, Bogangar, AU;

Simon J. Mahon, Avalon, AU;

Leif G. M. Snygg, Partille, SE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01P 3/10 (2006.01); H01L 23/492 (2006.01); H01L 23/66 (2006.01); H01L 23/06 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5286 (2013.01); H01L 23/492 (2013.01); H01L 23/66 (2013.01); H01P 3/10 (2013.01); H01L 23/06 (2013.01); H01L 23/498 (2013.01);
Abstract

An apparatus includes a laminate and a lid. The laminate generally includes a dielectric layer between a first conductive layer and a second conductive layer. The first conductive layer may include a probe configured to transfer a radio-frequency signal in a millimeter-wave band. The second conductive layer may be configured to provide a continuous ground plane parallel to the probe and separated from the probe by the dielectric layer. A plurality of channels may be (a) formed into a side of the second conductive layer opposite the dielectric layer, (b) formed to a depth less than a thickness of the second conductive layer, and (c) sized to permit gasses formed while securing the laminate to a substrate to escape from between the laminate and the substrate. The lid may be in contact with the first conductive layer.


Find Patent Forward Citations

Loading…