The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2019
Filed:
Aug. 09, 2017
Applicant:
Infineon Technologies Dresden Gmbh, Dresden, DE;
Inventors:
Assignee:
INFINEON TECHNOLOGIES DRESDEN GMBH, Dresden, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/492 (2006.01); H01L 23/522 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/492 (2013.01); H01L 23/3185 (2013.01); H01L 23/49562 (2013.01); H01L 24/05 (2013.01); H01L 24/19 (2013.01); H01L 21/561 (2013.01); H01L 23/315 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/522 (2013.01); H01L 24/06 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05005 (2013.01); H01L 2224/05011 (2013.01); H01L 2224/05013 (2013.01); H01L 2224/05017 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05026 (2013.01); H01L 2224/05096 (2013.01); H01L 2224/05541 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/05559 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/0615 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29366 (2013.01); H01L 2224/29369 (2013.01); H01L 2224/29371 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8382 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/83862 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/181 (2013.01); H01L 2924/206 (2013.01);
Abstract
In accordance with an embodiment of the present invention, a semiconductor device includes a semiconductor chip having a first side and an opposite second side, and a chip contact pad disposed on the first side of the semiconductor chip. A dielectric liner is disposed over the semiconductor chip. The dielectric liner includes a plurality of openings over the chip contact pad. A interconnect contacts the semiconductor chip through the plurality of openings at the chip contact pad.