The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2019
Filed:
Mar. 29, 2017
Applicant:
Qorvo Us, Inc., Greensboro, NC (US);
Inventors:
Jonathan J. Fain, Sachse, TX (US);
Mark C. Woods, Richardson, TX (US);
Assignee:
Qorvo US, Inc., Greensboro, NC (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/13 (2006.01); H01L 23/055 (2006.01); H01L 25/065 (2006.01); H01L 23/10 (2006.01); H05K 1/14 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/055 (2013.01); H01L 23/10 (2013.01); H01L 23/13 (2013.01); H01L 23/49838 (2013.01); H01L 25/0655 (2013.01); H01L 23/49827 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16113 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/16195 (2013.01); H05K 1/141 (2013.01); H05K 2201/10378 (2013.01);
Abstract
An electronics package includes a thermal lid over a flip chip component such that the thermal lid is in contact with a surface of a flip chip component and one or more thermal vias in a substrate on which the flip chip component is mounted. The thermal lid dissipates heat from the flip chip component by way of the thermal vias to improve the thermal performance of the electronics package.