The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2019
Filed:
Mar. 15, 2018
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Nobuchika Aoki, Tokyo, JP;
Rei Yoneyama, Tokyo, JP;
Akira Goto, Fukuoka, JP;
Akihiko Yamashita, Hyogo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/055 (2006.01); H01L 23/49 (2006.01); H01L 23/10 (2006.01); H01L 23/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/055 (2013.01); H01L 23/06 (2013.01); H01L 23/10 (2013.01); H01L 23/49 (2013.01);
Abstract
A semiconductor apparatus includes: a case made of resin; an insert terminal including an external terminal portion embedded in the case and having a first terminal exposed from the case, and an internal terminal portion bent in a L shape with respect to a second terminal of the external terminal portion and having a first surface exposed from the case and an anchor part in close contact with the case; and a bonding wire bonded to the first surface of the internal terminal portion.