logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10325723 B1

PDFFull Text
Date of Patent:
Jun. 18, 2019

Filed:

Nov. 21, 2018

Electronic component

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-do, KR;

Inventors:

Ho Yoon Kim, Suwon-Si, KR;

Sang Soo Park, Suwon-Si, KR;

Woo Chul Shin, Suwon-Si, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

Timothy J Thompson

Assistant Examiner:

Guillermo J Egoavil

Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/012 (2006.01); H01G 2/06 (2006.01); H01G 4/01 (2006.01); H01G 4/248 (2006.01); H05K 1/18 (2006.01); H01G 4/232 (2006.01); H01G 4/12 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01G 4/248 (2013.01); H01G 4/012 (2013.01); H01G 4/2325 (2013.01); H01G 4/30 (2013.01); H05K 1/181 (2013.01); H01G 4/1227 (2013.01); H01G 4/1245 (2013.01); H05K 1/112 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/2045 (2013.01);
Abstract

An electronic components includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, an interposer including an interposer body and a pair of external terminals, and an adhesive; wherein the external terminal includes a bonding portion, a mounting portion, and a connection portion; wherein an adhesive is provided between the external electrode and the bonding portion, and falls along the connection portion of the external terminal; wherein 1.55≤(L+T2)/T1 in which T2 is a height at which the adhesive falls along the connection portion of each of the external terminals, L is a length of the bonding portion, and T1 is a height of the electronic component.

Find Patent Forward Citations

Loading…