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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10325695 B1

PDFFull Text
Date of Patent:
Jun. 18, 2019

Filed:

Mar. 04, 2016

Rectangular wire, and method of producing the same and electrical equipment using the same

Applicants:

Furukawa Electric Co., Ltd., Tokyo, JP;

Furukawa Magnet Wire Co., Ltd., Tokyo, JP;

Inventors:

Hideo Fukuda, Tokyo, JP;

Dai Fujiwara, Tokyo, JP;

Tsuneo Aoi, Tokyo, JP;

Hiroshi Kaneiwa, Kariya, JP;

Takefumi Kaji, Kariya, JP;

Assignees:

Furukawa Electric Co., Ltd., Tokyo, JP;

Furukawa Magnet Wire Co., Ltd., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Roshn K Varghese

Int. Cl.
CPC ...
H01B 7/00 (2006.01); H01F 5/06 (2006.01); H02K 3/30 (2006.01); H01B 13/06 (2006.01); B32B 7/04 (2006.01); B32B 27/06 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); B32B 27/34 (2006.01); B32B 3/14 (2006.01); H01B 7/02 (2006.01); H01B 13/00 (2006.01); H02K 3/04 (2006.01); B32B 15/04 (2006.01); B32B 15/08 (2006.01); B32B 15/088 (2006.01); B32B 15/20 (2006.01); B32B 3/04 (2006.01); H01B 3/30 (2006.01);
U.S. Cl.
CPC ...
H01B 7/0009 (2013.01); B32B 3/04 (2013.01); B32B 3/14 (2013.01); B32B 7/045 (2013.01); B32B 15/04 (2013.01); B32B 15/08 (2013.01); B32B 15/088 (2013.01); B32B 15/20 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/281 (2013.01); B32B 27/285 (2013.01); B32B 27/286 (2013.01); B32B 27/288 (2013.01); B32B 27/34 (2013.01); H01B 7/0216 (2013.01); H01B 13/0036 (2013.01); H01B 13/065 (2013.01); H01F 5/06 (2013.01); H02K 3/04 (2013.01); H02K 3/30 (2013.01); B32B 2307/202 (2013.01); B32B 2307/30 (2013.01); B32B 2307/702 (2013.01); B32B 2457/00 (2013.01); H01B 3/308 (2013.01);
Abstract

A rectangular wire having: a multilayer conductor member constructed by stacking, in a thickness direction, a rectangular metallic conductor that has a layer of a first thermoplastic resin formed on the outer periphery thereof, the first thermoplastic resin being a non-crystalline resin having no melting point or a crystalline resin having an amide bond; and a layer of a second thermoplastic resin having a melting point of 300° C. or more on the outer periphery of the multilayer conductor member.

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