The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2019
Filed:
Aug. 28, 2014
Applicant:
E I Du Pont DE Nemours and Company, Wilmington, DE (US);
Inventors:
Minfang Mu, Shanghai, CN;
Yundan Wu, Shanghai, CN;
Assignee:
E I DU PONT DE NEMOURS AND COMPANY, Wilmington, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); B22F 7/08 (2006.01); C22C 9/00 (2006.01); H01B 1/16 (2006.01); H01L 31/0224 (2006.01); B22F 1/00 (2006.01); C22C 32/00 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); B22F 1/0003 (2013.01); B22F 1/0074 (2013.01); B22F 7/08 (2013.01); C22C 9/00 (2013.01); C22C 32/0089 (2013.01); H01B 1/16 (2013.01); H01L 31/0224 (2013.01); H01L 31/022425 (2013.01); B22F 1/0014 (2013.01); Y02E 10/50 (2013.01);
Abstract
Disclosed herein are copper-containing (Cu-containing) conductive pastes, copper (Cu) electrodes formed by firing the Cu-containing conductive paste over a substrate, and articles comprising a structural element with such Cu electrodes, wherein, the Cu-containing conductive paste contains a powder mixture of Cu, Ge, and B particles dispersed in an organic medium.