The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2019
Filed:
Jun. 05, 2015
Applicant:
Hewlett Packard Enterprise Development Lp, Houston, TX (US);
Inventors:
Dave Mayer, Fort Collins, CO (US);
Steven E. Hanzlik, Fort Collins, CO (US);
Assignee:
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP, Houston, TX (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); H05K 7/20 (2006.01); F28D 15/02 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
G06F 1/206 (2013.01); F28D 15/0233 (2013.01); G06F 1/20 (2013.01); H05K 7/20809 (2013.01); H01L 23/427 (2013.01); H05K 7/20145 (2013.01);
Abstract
In the examples provided herein, an apparatus has modules to be cooled during operation, where each module is coupled to a heatsink, and the heatsinks are coupled to a first surface of a thermally conductive plate. The modules are positioned along a direction from a first side of the plate toward an opposite side of the plate. The apparatus also has heat pipes coupled to a second surface of the plate to transport heat away from the modules during operation, where the heat pipes are positioned nonuniformly along the direction.