The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2019

Filed:

Jun. 03, 2016
Applicant:

Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;

Inventor:

Tomoyuki Hirayama, Ibaraki, JP;

Assignee:

NITTO DENKO CORPORATION, Ibaraki-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); H05K 1/02 (2006.01); C08L 63/00 (2006.01); H05K 1/03 (2006.01); G02B 6/122 (2006.01);
U.S. Cl.
CPC ...
G02B 6/12 (2013.01); C08L 63/00 (2013.01); G02B 6/1221 (2013.01); H05K 1/02 (2013.01); H05K 1/0274 (2013.01); H05K 1/0393 (2013.01);
Abstract

The present disclosure provides an optical waveguide formation photosensitive epoxy resin composition which contains an epoxy resin and a photo-cationic polymerization initiator, wherein the epoxy resin includes a solid epoxy resin component alone. Thus, a core layer forming material can be provided, which has higher R-to-R (roll-to-roll) adaptability and higher transparency at a wavelength of 850 nm. Therefore, a core layer for an optical waveguide can be formed as having excellent R-to-R adaptability, higher transparency and a lower loss by using the optical waveguide formation photosensitive epoxy resin composition without changing the conventional production process.


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