The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2019

Filed:

Sep. 10, 2014
Applicant:

Alfa Laval Corporate Ab, Lund, SE;

Inventors:

Per Sjödin, Lund, SE;

Kristian Walter, Genarp, SE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/20 (2006.01); B23K 1/19 (2006.01); B23K 35/22 (2006.01); B23K 35/36 (2006.01); F28F 21/08 (2006.01); C22C 9/00 (2006.01); C22C 19/03 (2006.01); C22C 19/05 (2006.01); C22C 19/07 (2006.01); C22C 38/00 (2006.01); C22C 38/18 (2006.01); C22C 38/40 (2006.01); C22C 38/44 (2006.01); C22C 38/58 (2006.01); F28D 9/00 (2006.01); B23K 1/00 (2006.01); B23K 1/008 (2006.01); B23K 35/365 (2006.01); B23K 20/02 (2006.01); B23K 20/16 (2006.01); B23K 35/00 (2006.01); B23K 35/30 (2006.01); B23K 35/02 (2006.01); F28F 21/00 (2006.01); B23K 101/14 (2006.01); F28F 3/02 (2006.01);
U.S. Cl.
CPC ...
F28F 21/081 (2013.01); B23K 1/008 (2013.01); B23K 1/0012 (2013.01); B23K 1/19 (2013.01); B23K 1/20 (2013.01); B23K 1/203 (2013.01); B23K 20/023 (2013.01); B23K 20/16 (2013.01); B23K 35/001 (2013.01); B23K 35/004 (2013.01); B23K 35/025 (2013.01); B23K 35/0222 (2013.01); B23K 35/3033 (2013.01); B23K 35/3053 (2013.01); B23K 35/3601 (2013.01); B23K 35/365 (2013.01); B23K 35/3612 (2013.01); C22C 9/00 (2013.01); C22C 19/03 (2013.01); C22C 19/056 (2013.01); C22C 19/058 (2013.01); C22C 19/07 (2013.01); C22C 38/00 (2013.01); C22C 38/18 (2013.01); C22C 38/40 (2013.01); C22C 38/44 (2013.01); C22C 38/58 (2013.01); F28D 9/0037 (2013.01); F28F 21/082 (2013.01); F28F 21/087 (2013.01); B23K 2101/14 (2018.08); F28F 3/025 (2013.01); F28F 2275/045 (2013.01);
Abstract

A method for joining a first metal part with a second metal part, the metal parts having a solidus temperature above 1000° C. The method includes applying a melting depressant composition on a surface of the first metal part, the melting depressant composition including a melting depressant component that includes phosphorus and silicon for decreasing a melting temperature of the first metal part; bringing the second metal part into contact with the melting depressant composition at a contact point on said surface; heating the first and second metal parts to a temperature above 1000° C.; and allowing a melted metal layer of the first metal component to solidify, such that a joint is obtained at the contact point. The melting depressant composition and related products are also described.


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