The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2019

Filed:

Dec. 18, 2014
Applicants:

Sumitomo (Sei) Steel Wire Corp., Itami-shi, JP;

Sumitomo Electric Industries, Ltd., Osaka-shi, JP;

Inventors:

Katsuhito Oshima, Itami, JP;

Masato Yamada, Itami, JP;

Yoshiyuki Matsubara, Itami, JP;

Kiminori Matsushita, Itami, JP;

Shuichi Tanaka, Itami, JP;

Jun Sugawara, Osaka, JP;

Shingo Nakajima, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
E04C 5/08 (2006.01); E04G 21/12 (2006.01); E04C 5/10 (2006.01); E04C 5/01 (2006.01);
U.S. Cl.
CPC ...
E04C 5/085 (2013.01); E04C 5/01 (2013.01); E04C 5/08 (2013.01); E04C 5/10 (2013.01); E04G 21/12 (2013.01);
Abstract

A pregrouted PC steel material () includes a 19-wire-twisted PC strand (), a pregrouted layer () disposed on an outer periphery of the PC strand (), and a sheath () configured to cover an outer periphery of the pregrouted layer (). A filling resin () is filled between steel wires (side wires) (). Since the filling resin () does not exude to the pregrouted layer () before tensioning of the PC strand (), an operation of tensioning the PC strand () is not hindered by curing of the pregrouted layer (). In contrast, since the gap between the steel wires is reduced when the PC strand () is tensioned, the filling resin () flows out (exudes) from between the steel wires to the pregrouted layer () to cure the pregrouted layer () only after the reduction.


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